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SRN2012-1R0M - Bourns

Description: Bourns SRN2012 Series Shielded Wire-wound SMD Inductor with a Ferrite Core, 1 μH ±20% 2.3A Idc

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Symbol
SRN2012-1R0M - Bourns - PCB symbol
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PCB Footprints
SRN2012-1R0M - Bourns PCB footprint - Other - Other - SRN2012-1R0M-2
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SRN2012-1R0M Details

  • Manufacturer Part Number:

    SRN2012-1R0M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.4

  • Case/Size Code:

    0806

  • Construction:

    Chip

  • Core Material:

    FERRITE

  • DC Resistance:

    0.104 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.2 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, 7 Inch

  • Rated Current-Max:

    2.3 A

  • Self Resonance Frequency:

    110 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

SRN2012-1R0M Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SRN2012-1R0M can be found in the Bourns application note AN-13, which provides guidelines for PCB layout and land pattern design.
  • The SRN2012-1R0M has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking and thermal management. A thermal pad on the bottom of the device can be connected to a copper plane on the PCB to dissipate heat.
  • The maximum current rating for the SRN2012-1R0M is 1A. However, it's essential to consider the power rating and thermal considerations to ensure the device operates within its specified limits.
  • The SRN2012-1R0M is designed for high-frequency applications up to 1 GHz. However, it's essential to consider the device's impedance and parasitic effects at high frequencies to ensure optimal performance.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the Bourns application note AN-13. Additionally, use a solder with a melting point below 260°C to prevent damage to the device.

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SRN2012-1R0M Overview

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