SRN2512-1R0M footprint, schematic symbol and 3D model by Bourns

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SRN2512-1R0M Details

The recommended land pattern for SRN2512-1R0M is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape.
Yes, SRN2512-1R0M is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the component's performance and lifespan may be affected at extreme temperatures.
Handle SRN2512-1R0M by the edges to prevent damage to the component's internal structure. Avoid touching the component's leads or body to prevent electrostatic discharge (ESD) damage.
Yes, SRN2512-1R0M is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5. However, the component's solderability may be affected by the specific soldering process used.
Store SRN2512-1R0M in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -20°C to 40°C, with a relative humidity of 60% or less.

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