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SRN8040TA-121M - Bourns

Description: BOURNS - SRN8040TA-121M - Power Inductor (SMD), AEC-Q200, 120 ?H, 1.1 A, Semishielded, 1.3 A, SRN8040TA Series

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PCB Footprints
SRN8040TA-121M - Bourns PCB footprint - Other - Other - SRN8040TA-121M-2
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3D Models
SRN8040TA-121M - Bourns  - 3D model - Other - SRN8040TA-121M-2
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SRN8040TA-121M Details

  • Manufacturer Part Number:

    SRN8040TA-121M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6.9

  • Case/Size Code:

    3131

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.35 Ω

  • Inductance-Nom (L):

    120 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    3.7 mm

  • Package Length:

    8 mm

  • Package Style:

    SMT

  • Package Width:

    8 mm

  • Packing Method:

    TR, 13 Inch

  • Quality Factor-Min (at L-nom):

    10

  • Rated Current-Max:

    1.1 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    7.5 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DC RESISTANCE IS MEASURED AT: 20%

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

SRN8040TA-121M Frequently Asked Questions (FAQs)

  • A symmetrical layout with a central grounding point is recommended. Keep the inductor away from high-frequency signals and ensure a solid ground plane underneath the component.
  • Ensure good airflow around the component, and consider using a thermal pad or heat sink if operating in high-temperature environments. Follow the recommended derating curves for temperature and current.
  • Follow the standard reflow soldering profile with a peak temperature of 260°C (500°F) for 10-15 seconds. Avoid excessive thermal stress and ensure proper solder wetting.
  • While the SRN8040TA-121M is a high-quality component, it may not meet the specific requirements for high-reliability or aerospace applications. Consult with Bourns Inc or a qualified engineer to determine suitability.
  • Use shielding, filtering, and proper PCB layout to minimize EMI. Consider using additional components, such as common-mode chokes or EMI filters, to meet specific EMI requirements.

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