SRP1038A-2R2M footprint, schematic symbol and 3D model by Bourns

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SRP1038A-2R2M Details

The recommended land pattern for SRP1038A-2R2M is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
Yes, SRP1038A-2R2M is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the component's performance and reliability may degrade at extreme temperatures.
Handle the SRP1038A-2R2M by the edges to prevent damage to the component. Use a vacuum pickup or tweezers to handle the component, and avoid touching the component's leads or body. For rework, use a low-temperature soldering iron and a solder with a low melting point to minimize thermal stress.
The MSL of SRP1038A-2R2M is 1, which means it can withstand normal humidity and temperature conditions without special handling or storage requirements.
Yes, SRP1038A-2R2M is designed to withstand vibrations up to 10 G, making it suitable for applications with moderate vibration levels. However, it's essential to ensure proper mounting and securing of the component to prevent mechanical stress.

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