SRP1038CC-8R2M footprint, schematic symbol and 3D model by Bourns

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SRP1038CC-8R2M Details

The recommended land pattern for SRP1038CC-8R2M can be found in the Bourns Application Note S-8153, which provides guidelines for PCB layout and land pattern design.
While the SRP1038CC-8R2M is rated for operation up to 125°C, it's essential to consider the derating curves and thermal management to ensure reliable operation in high-temperature environments.
To prevent ESD damage, follow proper handling and storage procedures, such as using ESD-safe materials, grounding yourself before handling the component, and avoiding direct contact with the component's pins.
Bourns recommends following the JEDEC J-STD-020D.1 standard for soldering profiles, which provides guidelines for temperature, time, and other parameters to ensure reliable solder joints.
While the SRP1038CC-8R2M is designed to be robust, it's essential to consider the vibration specifications and ensure that the component is properly secured to the PCB to prevent mechanical stress and damage.

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Use the download button to access the SRP1038CC-8R2M schematic symbol, PCB footprint, and 3D model.

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