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SRP1770C-330M - Bourns

Description: Fixed Inductors Ind,17.8x16.9x6.7mm33uH 20%,10.7A,ShdSMD

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Symbol
SRP1770C-330M - Bourns - PCB symbol
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PCB Footprints
SRP1770C-330M - Bourns PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - SRP1770C
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3D Models
SRP1770C-330M - Bourns - 3D model - Inductors Precision Moulded - SRP1770C
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SRP1770C-330M Details

  • Manufacturer Part Number:

    SRP1770C-330M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    0

  • Case/Size Code:

    6767

  • Construction:

    Rectangular

  • Core Material:

    POWDERED METAL ALLOY

  • DC Resistance:

    0.042 Ω

  • Inductance-Nom (L):

    33 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e2

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    6.7 mm

  • Package Length:

    16.9 mm

  • Package Style:

    SMT

  • Package Width:

    16.9 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Quality Factor-Min (at L-nom):

    20

  • Rated Current-Max:

    10.7 A

  • Self Resonance Frequency:

    6 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Nickel (Sn/Ni)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP1770C-330M Frequently Asked Questions (FAQs)

  • A recommended PCB layout for the SRP1770C-330M is to use a symmetrical layout with the inductor centered on the PCB, and to keep the inductor away from other components to minimize electromagnetic interference (EMI).
  • To ensure the SRP1770C-330M operates within its specified temperature range, ensure good airflow around the component, avoid overheating due to high current or voltage, and consider using a heat sink if necessary.
  • The recommended soldering profile for the SRP1770C-330M is a peak temperature of 260°C for 10-15 seconds, with a ramp-up rate of 3°C/second and a ramp-down rate of 6°C/second.
  • Yes, the SRP1770C-330M is designed to withstand high-vibration environments, but it's recommended to follow the manufacturer's guidelines for vibration testing and to ensure the component is properly secured to the PCB.
  • To ensure optimal reliability, handle the SRP1770C-330M by the body, avoid touching the leads or core, and store the component in a dry, cool place away from direct sunlight.

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SRP1770C-330M Overview

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