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SRP2010DPA-3R3M - Bourns

Description: Shielded Power Inductor

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PCB Footprints
SRP2010DPA-3R3M - Bourns PCB footprint - Inductors Chip - Inductors Chip - SRP2010-1
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3D Models
SRP2010DPA-3R3M - Bourns  - 3D model - Inductors Chip - SRP2010-1
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SRP2010DPA-3R3M Details

  • Manufacturer Part Number:

    SRP2010DPA-3R3M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    3

  • Case/Size Code:

    0806

  • Construction:

    Rectangular

  • Core Material:

    POWDERED METAL ALLOY

  • DC Resistance:

    0.225 Ω

  • Inductance-Nom (L):

    3.3 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Embossed, 7 Inch

  • Rated Current-Max:

    1.4 A

  • Reference Standard:

    AEC-Q200

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

SRP2010DPA-3R3M Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with a solid ground plane, and keeping the input and output traces as short as possible to minimize parasitic inductance and capacitance.
  • Bourns recommends using a soldering iron with a temperature of 250°C to 260°C, and applying a small amount of solder to the pads. Avoid applying excessive force or pressure, which can damage the component.
  • The SRP2010DPA-3R3M is rated for operation from -40°C to +125°C, but derating may be necessary for high-temperature applications. Consult the datasheet for specific derating curves.
  • Yes, the SRP2010DPA-3R3M is designed to withstand vibrations up to 10g, but it's recommended to secure the component to the PCB using a suitable adhesive or mechanical fastening method to prevent movement or damage.
  • Bourns recommends following standard ESD handling procedures, including using an ESD wrist strap, mat, or workstation, and storing the components in ESD-protective packaging when not in use.

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SRP2010DPA-3R3M Overview

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