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SRP2012TMA-1R0M - Bourns

Description: Ind,2x1.6x1mm,1uH±20%,3.7A,shd

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PCB Footprints
SRP2012TMA-1R0M - Bourns PCB footprint - Other - Other - SRP2012TMA-1R0M-4
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3D Models
SRP2012TMA-1R0M - Bourns  - 3D model - Other - SRP2012TMA-1R0M-4
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SRP2012TMA-1R0M Details

  • Manufacturer Part Number:

    SRP2012TMA-1R0M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.8

  • Case/Size Code:

    0806

  • Construction:

    Rectangular

  • Core Material:

    POWDERED METAL ALLOY

  • DC Resistance:

    0.048 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, 7 Inch

  • Rated Current-Max:

    3.7 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    70 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

SRP2012TMA-1R0M Frequently Asked Questions (FAQs)

  • The recommended land pattern for SRP2012TMA-1R0M is available in the Bourns Application Note S-8151, which provides detailed guidelines for PCB layout and assembly.
  • While the SRP2012TMA-1R0M is rated for operation up to 125°C, it's essential to consider the derating curves and thermal management strategies to ensure reliable performance in high-temperature applications.
  • To prevent ESD damage, follow proper handling and storage procedures, such as using anti-static bags, wrist straps, and mats. Also, ensure that your PCB design includes ESD protection components and follows ESD-safe assembly practices.
  • The ESR of SRP2012TMA-1R0M is not explicitly stated in the datasheet, but it can be estimated based on the impedance vs. frequency characteristics. For a more accurate value, contact Bourns' technical support or consult the component's Spice model.
  • While the SRP2012TMA-1R0M is designed for general-purpose use, its high-frequency performance may not be optimal. For high-frequency applications, consider using specialized components with lower ESL and ESR, and consult Bourns' high-frequency component offerings.

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SRP2012TMA-1R0M Overview

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