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SRP3212-3R3M - Bourns

Description: Ind,3.2x2.5x1mm,3.3uH?20%,3.1A,shd

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PCB Footprints
SRP3212-3R3M - Bourns PCB footprint - Inductors Chip - Inductors Chip - SRP3212
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3D Models
SRP3212-3R3M - Bourns  - 3D model - Inductors Chip - SRP3212
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SRP3212-3R3M Details

  • Manufacturer Part Number:

    SRP3212-3R3M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.3

  • Case/Size Code:

    1310

  • Construction:

    Rectangular

  • Core Material:

    METAL ALLOY POWDER

  • DC Resistance:

    0.101 Ω

  • Inductance-Nom (L):

    3.3 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, 7 Inch

  • Rated Current-Max:

    3.1 A

  • Self Resonance Frequency:

    28 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP3212-3R3M Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SRP3212-3R3M can be found in the Bourns Application Note S-8151, which provides detailed guidelines for PCB layout and land pattern design.
  • While the SRP3212-3R3M is rated for operation up to 125°C, it's essential to consider the derating curves and thermal management strategies to ensure reliable operation in high-temperature environments. Consult with a Bourns application engineer for specific guidance.
  • To minimize EMI and RFI emissions, follow proper PCB design and layout practices, such as using a solid ground plane, minimizing loop areas, and using shielding or filtering components as needed. Additionally, consider using a common-mode choke or other EMI filtering components in conjunction with the SRP3212-3R3M.
  • The SRP3212-3R3M is rated for a maximum surge current of 100 A, as specified in the datasheet. However, it's essential to consider the specific application requirements and ensure that the device is properly sized and protected to handle expected surge currents.
  • Yes, the SRP3212-3R3M can be used in redundant or parallel configurations to achieve higher current ratings or improved reliability. However, it's crucial to ensure that the devices are properly matched and that the system is designed to handle the increased current and thermal requirements.

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SRP3212-3R3M Overview

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