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SRP3212A-R33M - Bourns

Description: Ind,3.2x2.5x1mm,0.33uH±20%,8.5A,shd

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PCB Footprints
SRP3212A-R33M - Bourns PCB footprint - Inductors Chip - Inductors Chip - SRP3212A
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3D Models
SRP3212A-R33M - Bourns  - 3D model - Inductors Chip - SRP3212A
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SRP3212A-R33M Details

  • Manufacturer Part Number:

    SRP3212A-R33M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.8

  • Case/Size Code:

    1210

  • Construction:

    Rectangular

  • Core Material:

    POWDERED METAL ALLOY

  • DC Resistance:

    0.013 Ω

  • Inductance-Nom (L):

    0.33 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, 7 Inch

  • Rated Current-Max:

    8.5 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    132 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Nickel/Silver (Sn/Ni/Ag)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP3212A-R33M Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with a solid ground plane, and keeping the input and output traces as short as possible to minimize parasitic inductance and capacitance.
  • While the SRP3212A-R33M is rated for operation up to 125°C, it's essential to consider the derating curves and thermal management to ensure reliable operation in high-temperature environments.
  • Follow the recommended soldering profile and use a solder with a melting point above 217°C to ensure a reliable connection. Avoid excessive soldering temperatures and times to prevent damage to the component.
  • Store the SRP3212A-R33M in a dry, cool place, away from direct sunlight and moisture. Handle the components by the body, avoiding touching the leads or pads to prevent damage or contamination.
  • While the SRP3212A-R33M is designed to be robust, it's essential to consider the mechanical stress and vibration specifications to ensure reliable operation in high-vibration or high-shock environments.

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SRP3212A-R33M Overview

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