SRP5030T-1R5M footprint, schematic symbol and 3D model by Bourns

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SRP5030T-1R5M Details

The recommended land pattern for the SRP5030T-1R5M can be found in the Bourns application note AN-13, which provides guidelines for PCB layout and land pattern design.
The SRP5030T-1R5M has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking and thermal management. A thermal pad on the bottom of the device can be connected to a copper plane on the PCB to dissipate heat.
The maximum current rating for the SRP5030T-1R5M is 1.5A. However, it's essential to consider the device's power rating, PCB thermal design, and ambient temperature to ensure reliable operation.
The SRP5030T-1R5M is designed for low-frequency applications. While it can be used in high-frequency applications, its performance may degrade due to the device's internal inductance and capacitance. It's recommended to evaluate the device's performance in the specific application and consider alternative components if necessary.
To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the Bourns application note AN-13. Additionally, use a solder with a melting point compatible with the device's temperature rating.

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