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SRP5030T-6R8M - Bourns

Description: Bourns SRP5030T Series Shielded Wire-wound SMD Inductor with a Iron Core, 6.8 μH ±20% 4A Idc

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PCB Footprints
SRP5030T-6R8M - Bourns PCB footprint - Inductor Moulded - Inductor Moulded - SRP5030T
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3D Models
SRP5030T-6R8M - Bourns  - 3D model - Inductor Moulded - SRP5030T
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SRP5030T-6R8M Details

  • Manufacturer Part Number:

    SRP5030T-6R8M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7

  • Case/Size Code:

    2220

  • Construction:

    Rectangular

  • Core Material:

    POWDERED IRON

  • DC Resistance:

    0.0762 Ω

  • Inductance-Nom (L):

    6.8 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    2.8 mm

  • Package Length:

    5.7 mm

  • Package Style:

    SMT

  • Package Width:

    5.2 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Rated Current-Max:

    4 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP5030T-6R8M Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SRP5030T-6R8M can be found in the Bourns application note AN-13, which provides guidelines for PCB layout and land pattern design.
  • The SRP5030T-6R8M has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking and thermal management. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink.
  • The maximum current rating for the SRP5030T-6R8M is 3A. However, it's essential to consider the device's power rating, PCB thermal design, and operating conditions to ensure reliable operation.
  • The SRP5030T-6R8M is designed for high-frequency applications up to 1 GHz. However, it's crucial to consider the device's self-resonant frequency, parasitic inductance, and capacitive coupling when designing high-frequency circuits.
  • To ensure the SRP5030T-6R8M meets your specific application's requirements, it's recommended to consult with a Bourns application engineer or perform thorough testing and characterization of the device in your specific application.

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