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SRP5050FA-220M1 - Bourns

Description: 22 µH Shielded Drum Core, Wirewound Inductor 3.4 A 99.65mOhm Max Nonstandard

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Symbol
SRP5050FA-220M1 - Bourns - PCB symbol
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PCB Footprints
SRP5050FA-220M1 - Bourns PCB footprint - Other - Other - SRP5050FA-220M1-2
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3D Models
SRP5050FA-220M1 - Bourns - 3D model - Other - SRP5050FA-220M1-2
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SRP5050FA-220M1 Details

  • Manufacturer Part Number:

    SRP5050FA-220M1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active Unconfirmed

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7

  • Case/Size Code:

    2422

  • Construction:

    Rectangular

  • Core Material:

    METAL ALLOY POWDER

  • DC Resistance:

    0.09965 Ω

  • Inductance-Nom (L):

    22 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    4.8 mm

  • Package Length:

    6 mm

  • Package Style:

    SMT

  • Package Width:

    5.7 mm

  • Packing Method:

    TR, Embossed , 13 Inch

  • Rated Current-Max:

    3.4 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    8 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP5050FA-220M1 Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with a solid ground plane to minimize electromagnetic interference (EMI) and ensure optimal performance. A minimum of 2 oz copper thickness is recommended for the PCB.
  • Bourns recommends using a soldering iron with a temperature range of 250°C to 260°C and a solder with a melting point of 180°C to 190°C. The component should be soldered within 3 seconds to prevent thermal damage.
  • The SRP5050FA-220M1 is rated for operation from -40°C to 125°C, but derating is required above 85°C. Consult the datasheet for specific derating curves.
  • Yes, the SRP5050FA-220M1 is designed to withstand high-vibration environments. However, it's essential to ensure proper PCB mounting and secure the component using a suitable adhesive or mechanical fastening method.
  • Bourns recommends using ESD protection devices, such as TVS diodes or ESD suppressors, in conjunction with the SRP5050FA-220M1 to prevent damage from electrostatic discharge.

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SRP5050FA-220M1 Overview

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