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SRP6060FA-100M - Bourns

Description: Fixed Inductors 10uH 20% 7A

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SRP6060FA-100M - Bourns - PCB symbol
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PCB Footprints
SRP6060FA-100M - Bourns PCB footprint - Other - Other - SRP6060FA-4R7M
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3D Models
SRP6060FA-100M - Bourns - 3D model - Other - SRP6060FA-4R7M
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SRP6060FA-100M Details

  • Manufacturer Part Number:

    SRP6060FA-100M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7

  • Case/Size Code:

    2625

  • Construction:

    Rectangular

  • Core Material:

    POWDERED METAL ALLOY

  • DC Resistance:

    0.0293 Ω

  • Inductance-Nom (L):

    10 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    5.8 mm

  • Package Length:

    6.6 mm

  • Package Style:

    SMT

  • Package Width:

    6.4 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Rated Current-Max:

    7 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    12 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP6060FA-100M Frequently Asked Questions (FAQs)

  • A good PCB layout for the SRP6060FA-100M involves keeping the input and output traces separate, using a solid ground plane, and minimizing the length of the input and output traces. It's also recommended to use a common mode choke or a ferrite bead to filter out high-frequency noise.
  • To ensure reliability in high-temperature applications, it's essential to follow the recommended derating curves for the SRP6060FA-100M. Additionally, ensure good airflow, use a heat sink if necessary, and avoid exceeding the maximum operating temperature of 125°C.
  • The recommended soldering profile for the SRP6060FA-100M involves a peak temperature of 260°C, a dwell time of 10-30 seconds, and a ramp-up rate of 3°C/second. It's also essential to use a solder with a melting point above 217°C.
  • Yes, the SRP6060FA-100M is designed to withstand high-vibration environments. However, it's essential to ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent damage or dislodging.
  • To troubleshoot issues with the SRP6060FA-100M, start by checking the input and output voltages, ensuring that they are within the recommended specifications. Next, verify that the component is properly soldered and that there are no signs of physical damage. If the issue persists, consult the datasheet and application notes for further guidance.

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SRP6060FA-100M Overview

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