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SRP7030CA-8R2M - Bourns

Description: Power Inductors - SMD Ind,7.8x7.6x2.9mm,8.2uH+/-20%,5.9A,Shd,SMD

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Symbol
SRP7030CA-8R2M - Bourns - PCB symbol
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PCB Footprints
SRP7030CA-8R2M - Bourns PCB footprint - Other - Other - 7.8x7.6x2.9mm
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3D Models
SRP7030CA-8R2M - Bourns - 3D model - Other - 7.8x7.6x2.9mm
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SRP7030CA-8R2M Details

  • Manufacturer Part Number:

    SRP7030CA-8R2M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7

  • Case/Size Code:

    3130

  • Construction:

    Rectangular

  • Core Material:

    POWDERED METAL ALLOY

  • DC Resistance:

    0.04873 Ω

  • Inductance-Nom (L):

    8.2 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    2.9 mm

  • Package Length:

    7.8 mm

  • Package Style:

    SMT

  • Package Width:

    7.6 mm

  • Packing Method:

    TR, Embossed , 13 Inch

  • Rated Current-Max:

    5.9 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    12 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SRP7030CA-8R2M Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SRP7030CA-8R2M can be found in the Bourns Application Note S-8151, which provides detailed information on pad layout and spacing for optimal performance and reliability.
  • While the SRP7030CA-8R2M is rated for operation up to 125°C, it's essential to consider the derating curves and thermal management strategies to ensure reliable operation in high-temperature environments. Consult the datasheet and Bourns' thermal management guidelines for more information.
  • To prevent damage during PCB assembly, follow standard handling and storage procedures for chip resistors, including avoiding excessive bending, flexing, or mechanical stress. Use ESD protection and handle the components by the edges to prevent damage to the termination pads.
  • The SRP7030CA-8R2M is designed to meet the requirements of IPC/JEDEC J-STD-020, which includes humidity testing. However, it's still essential to consider the specific environmental conditions and potential moisture-related issues in your application. Consult the datasheet and Bourns' reliability guidelines for more information.
  • The recommended soldering profile for the SRP7030CA-8R2M follows the IPC/JEDEC J-STD-020 standard, which specifies a peak temperature of 260°C and a dwell time of 30-40 seconds. Consult the datasheet and Bourns' soldering guidelines for more information.

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SRP7030CA-8R2M Overview

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