SRR0805-150M - Bourns

SRR0805-150M Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the SRR0805-150M?
  The recommended land pattern for the SRR0805-150M is a rectangular pad with a size of 0.8mm x 0.5mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
• Can I use the SRR0805-150M in a high-temperature environment?
  The SRR0805-150M is rated for operation up to 125°C, but it's not recommended to use it in applications that exceed this temperature. Prolonged exposure to high temperatures can affect the component's reliability and lifespan.
• How do I handle the SRR0805-150M during assembly to prevent damage?
  Handle the SRR0805-150M by the edges or the body, avoiding touching the leads or the component's surface. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage.
• Can I use the SRR0805-150M in a high-vibration environment?
  The SRR0805-150M is designed to withstand moderate vibration levels, but it's recommended to follow proper mounting and soldering techniques to ensure the component remains securely attached to the PCB. Excessive vibration can cause the component to detach or fail.
• What is the recommended soldering profile for the SRR0805-150M?
  The recommended soldering profile for the SRR0805-150M is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Avoid using excessive soldering temperatures or times, as this can damage the component.