SRR4011-101YL - Bourns

SRR4011-101YL Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal performance?
  Bourns recommends a symmetrical PCB layout with a ground plane underneath the device to minimize electromagnetic interference (EMI) and ensure optimal performance. A minimum of 2 oz copper thickness is recommended for the PCB.
• How do I handle the thermal considerations for this device?
  The SRR4011-101YL has a maximum junction temperature of 150°C. Ensure proper thermal management by providing adequate heat sinking, using thermal vias, and keeping the device away from heat sources. A thermal pad on the bottom of the device can be connected to a ground plane or a heat sink to improve heat dissipation.
• What is the recommended soldering process for this device?
  Bourns recommends a reflow soldering process with a peak temperature of 260°C for 10-30 seconds. Hand soldering is not recommended due to the device's small size and high pin count. Ensure that the soldering process is done in a nitrogen atmosphere to prevent oxidation.
• How do I ensure electromagnetic compatibility (EMC) with this device?
  To ensure EMC, use a shielded enclosure, and keep the device away from other components that may generate electromagnetic interference (EMI). Use a common-mode choke or a ferrite bead on the input lines to reduce EMI. Additionally, ensure that the PCB layout is designed to minimize radiation and coupling.
• What is the device's behavior during power-up and power-down?
  The SRR4011-101YL has a soft-start feature that limits the inrush current during power-up. The device also has an undervoltage lockout (UVLO) feature that prevents it from operating below a certain voltage threshold. During power-down, the device will shut down and enter a low-power state.