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SRU2009-3R3Y - Bourns

Description: Bourns SRU2009 Series Shielded Wire-wound SMD Inductor with a Ferrite Core, 3.3 µH ±30% Wire-Wound 800mA Idc Q:7

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SRU2009-3R3Y Details

  • Manufacturer Part Number:

    SRU2009-3R3Y

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.1

  • Case/Size Code:

    1111

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.32 Ω

  • Inductance-Nom (L):

    3.3 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    0.9 mm

  • Package Length:

    2.8 mm

  • Package Style:

    SMT

  • Package Width:

    2.8 mm

  • Packing Method:

    TR, Embossed, 7 Inch

  • Rated Current-Max:

    0.8 A

  • Self Resonance Frequency:

    100 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    30%

SRU2009-3R3Y Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with a solid ground plane, and keeping the input and output traces as short as possible to minimize parasitic inductance and capacitance.
  • Bourns recommends derating the current rating of the SRU2009-3R3Y by 1.5% per degree Celsius above 40°C to ensure reliable operation in high-temperature environments.
  • Bourns recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 4°C/second to prevent thermal shock and ensure reliable solder joints.
  • Yes, the SRU2009-3R3Y is designed to withstand vibrations up to 10G, but Bourns recommends securing the component to the PCB using a suitable adhesive or mechanical fastening method to prevent movement and ensure reliable operation.
  • The expected lifespan of the SRU2009-3R3Y is 10-15 years, depending on operating conditions, but Bourns recommends following the recommended usage guidelines and environmental conditions to ensure maximum lifespan.

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SRU2009-3R3Y Overview

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