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SRV05-4MR6T1G - onsemi

Description: ON SEMICONDUCTOR - SRV05-4MR6T1G - ESD Protection Device, 17.5 V, TSOP, 6 Pins, 300 W

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Symbol
SRV05-4MR6T1G - onsemi - PCB symbol
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PCB Footprints
SRV05-4MR6T1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOP−6 CASE 318G−02 ISSUE V
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3D Models
SRV05-4MR6T1G - onsemi - 3D model - SOT23 (6-Pin) - TSOP−6 CASE 318G−02 ISSUE V
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SRV05-4MR6T1G Details

  • Manufacturer Part Number:

    SRV05-4MR6T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    318G-02

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    6.28

  • Additional Feature:

    LOW CAPACITANCE

  • Breakdown Voltage-Min:

    6 V

  • Clamping Voltage-Max:

    17.5 V

  • Configuration:

    SINGLE, 4 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    300 W

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2, 4-4, 4-5

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SRV05-4MR6T1G Frequently Asked Questions (FAQs)

  • A good PCB layout should ensure minimal thermal resistance, use thermal vias, and keep the device away from heat sources. A heat sink or thermal pad can be used to improve heat dissipation. Refer to onsemi's application notes for more information.
  • Follow onsemi's guidelines for PCB layout, use shielding, and ensure proper grounding. Additionally, use filters or chokes to reduce electromagnetic interference (EMI). Consult onsemi's application notes and relevant industry standards for more information.
  • The SRV05-4MR6T1G is designed to meet industry standards for reliability. Typical lifetimes are in the range of 10-20 years, depending on operating conditions. Refer to onsemi's reliability reports and application notes for more information.
  • The SRV05-4MR6T1G is rated for operation up to 150°C. However, derating may be necessary for prolonged exposure to high temperatures. Consult onsemi's datasheet and application notes for specific guidance.
  • Consult onsemi's troubleshooting guides and application notes. Common issues include overheating, incorrect PCB layout, or inadequate power supply. Verify the device is used within specified operating conditions and follow onsemi's recommended design practices.

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SRV05-4MR6T1G Overview

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