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SS13FP - onsemi

Description: Larger Cathode Pad for Improved Power Dissipation; Low Power Loss, High Efficiency; Ultra Thin Profile - Package Height < 1.0 mm; UL Flammability 94V-0 Classification; High Surge Current Capability; Industrial Device Qualified per AEC-Q101 Standards; * See authorized use policy; MSL 1 per J-STD-020; RoHS Compliant / Green Molding Compound

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SS13FP Details

  • Manufacturer Part Number:

    SS13FP

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 FL

  • Manufacturer Package Code:

    425AC

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.1

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    30 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.5 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    400 µA

  • Reverse Recovery Time-Max:

    0.006 µs

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SS13FP Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
  • Ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The maximum allowable voltage on the anode (A) pin is 1.5V above the cathode (K) pin voltage to prevent internal diode conduction.
  • While possible, it's not recommended to use the SS13FP as a switch due to its high voltage drop and limited current handling. Instead, consider using a dedicated switch or a more suitable device for switching applications.
  • Use a TVS (Transient Voltage Suppressor) or a zener diode to clamp overvoltages. For ESD protection, add a series resistor and a capacitor to the input lines, and consider using ESD protection devices.

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SS13FP Overview

Use the download button to access the SS13FP 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like SS13F, or try a keyword search, such as Rectifier Diodes

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