A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
Ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout. Also, consider derating the device's current handling capability at high temperatures (above 125°C).
The maximum allowable voltage on the gate pin is ±20V, but it's recommended to keep it within ±15V to ensure reliable operation and prevent damage to the device.
Yes, but be aware that the device's switching frequency is limited by its internal capacitance and inductance. Above 100 kHz, the device's performance may degrade. Use a gate driver with a low output impedance and a short gate resistor to minimize ringing and ensure reliable switching.
Use ESD protection devices, such as TVS diodes or ESD suppressors, on the input and output pins. Ensure that the PCB design includes ESD protection features, such as a Faraday cage or ESD shielding. Handle the device with ESD-safe materials and follow proper ESD handling procedures.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
SS16HE Overview
Use the download button to access the SS16HE schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SS16H,
or try a keyword search, such as Rectifier Diodes
Suggested Parts
If you searched for SS16HE, you might also be interested in these parts: