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SS16HE - onsemi

Description: ON Semi 60V 1A, Diode, 2-Pin SOD-323HE SS16HE

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PCB Footprints
SS16HE - onsemi PCB footprint - Other - Other - SOD−323EP_2023
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3D Models
SS16HE - onsemi  - 3D model - Other - SOD−323EP_2023
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SS16HE Details

  • Manufacturer Part Number:

    SS16HE

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-323 EP

  • Package Description:

    SOD-323EP, 2 PIN

  • Manufacturer Package Code:

    477AD

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6.07

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    60 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.68 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    25 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    50 µA

  • Reverse Recovery Time-Max:

    0.0083 µs

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SS16HE Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout. Also, consider derating the device's current handling capability at high temperatures (above 125°C).
  • The maximum allowable voltage on the gate pin is ±20V, but it's recommended to keep it within ±15V to ensure reliable operation and prevent damage to the device.
  • Yes, but be aware that the device's switching frequency is limited by its internal capacitance and inductance. Above 100 kHz, the device's performance may degrade. Use a gate driver with a low output impedance and a short gate resistor to minimize ringing and ensure reliable switching.
  • Use ESD protection devices, such as TVS diodes or ESD suppressors, on the input and output pins. Ensure that the PCB design includes ESD protection features, such as a Faraday cage or ESD shielding. Handle the device with ESD-safe materials and follow proper ESD handling procedures.

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SS16HE Overview

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