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SS19FA - onsemi

Description: MSL 1 per J-STD-020; Guard Ring for Overvoltage Protection; UL Flammability 94V-0 Classification; High Surge Current Capability; * See authorized use policy; Low Power Loss, High Efficiency; RoHS Compliant / Green Molding Compound; Industrial Device Qualified per AEC-Q101 Standards

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PCB Footprints
SS19FA - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-123FA
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3D Models
SS19FA - onsemi  - 3D model - Small Outline Diode Flat Lead - SOD-123FA
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SS19FA Details

  • Manufacturer Part Number:

    SS19FA

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 FL

  • Manufacturer Package Code:

    425AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.07

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    90 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.8 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    90 V

  • Reverse Current-Max:

    50 µA

  • Reverse Recovery Time-Max:

    0.0083 µs

  • Reverse Test Voltage:

    90 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SS19FA Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, a thermal relief pattern can be used to reduce thermal resistance.
  • Ensure that the device is operated within the recommended temperature range (−40°C to +150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Also, consider derating the device's power handling at high temperatures.
  • A reflow soldering profile with a peak temperature of 260°C (±5°C) and a dwell time of 20-40 seconds is recommended. The temperature should rise at a rate of 3°C/second and cool at a rate of 6°C/second.
  • Handle the device in an ESD-controlled environment. Use ESD-protective packaging and wrist straps. Ground all equipment and tools to prevent static buildup. Avoid touching the device's pins or leads.
  • Store the device in its original packaging or in a dry, ESD-protected environment. Avoid exposing the device to moisture, direct sunlight, or extreme temperatures. Handle the device by the body, not the leads.

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SS19FA Overview

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