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SS26T3G - onsemi

Description: Compact Package with J–Bend Leads Ideal for Automated Handling; Highly Stable Oxide Passivated Junction; Guardring for Over–Voltage Protection; Low Forward Voltage Drop Mechanical Characteristics:; Case: Molded Epoxy; Epoxy Meets UL94, VO at 1/8 inch; Weight: 95 mg (approximately); Cathode Polarity Band; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; Available in 12 mm Tape, 2500 Units per 13 inch Reel, Add "T3" Suffix to Part Number; Finish: All External Surfaces C

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PCB Footprints
SS26T3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A-03 ISSUE J
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3D Models
SS26T3G - onsemi  - 3D model - Diodes Moulded - SMB CASE 403A-03 ISSUE J
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SS26T3G Details

  • Manufacturer Part Number:

    SS26T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMB

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    POWER

  • Breakdown Voltage-Min:

    60 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.63 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    40 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SS26T3G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance of the SS26T3G includes a thermal pad connected to a large copper area on the PCB, with multiple vias to dissipate heat efficiently.
  • To ensure reliability in high-temperature applications, ensure the device is operated within the recommended temperature range, use a suitable thermal interface material, and follow proper PCB design and assembly guidelines.
  • The SS26T3G has built-in ESD protection, but additional external protection may be necessary depending on the application. Follow proper ESD handling and storage procedures to prevent damage.
  • Yes, the SS26T3G can be used in high-frequency switching applications, but ensure the device is operated within the recommended frequency range and follow proper PCB design guidelines to minimize parasitic inductance and capacitance.
  • Select the correct package type based on your application's thermal, power, and space requirements. The SS26T3G is available in TO-220, TO-263, and TO-252 packages, each with its own thermal and power handling characteristics.

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SS26T3G Overview

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Part Image SS26/52T Vishay Semiconductors

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For a full list of alternate parts for SS26T3G, check out Findchips.com