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SSM2019BRWZ - Analog Devices

Description: 7.6mm SSM2019BRWZ, Audio Amplifier Class-AB mono 74dB +85°C 16-Pin SOIC W

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PCB Footprints
SSM2019BRWZ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 16-Pin SOIC W_2024
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SSM2019BRWZ - Analog Devices  - 3D model - Small Outline Packages - 16-Pin SOIC W_2024
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SSM2019BRWZ Details

  • Manufacturer Part Number:

    SSM2019BRWZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    RW-16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Bandwidth-Nom:

    200 kHz

  • Consumer IC Type:

    CLASS AB AUDIO AMPLIFIER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.25 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    7.5 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

SSM2019BRWZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate analog ground plane is recommended. Keep the input and output traces short and away from digital signals.
  • Use a minimum output capacitance of 10uF with an ESR of 0.1 ohm or less. Also, ensure the output voltage is within the recommended range (1.2V to 3.3V) and the input voltage is within the recommended range (2.7V to 5.5V).
  • The maximum input voltage that can be applied to the VIN pin is 5.5V. Exceeding this voltage may damage the device.
  • Use a low-ESR output capacitor (e.g., ceramic or film capacitor) and add a 10nF to 100nF bypass capacitor between the VIN pin and the GND pin. Also, minimize the distance between the output capacitor and the load.
  • The thermal derating is 6.67mW/°C above 25°C. Ensure proper heat sinking and thermal management to prevent overheating.

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SSM2019BRWZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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