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SSM2141SZ - Analog Devices

Description: High Common-Mode Rejection Differential Line Receiver

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SSM2141SZ - Analog Devices PCB footprint - Other - Other - SOIC127P600X175-8N
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SSM2141SZ - Analog Devices  - 3D model - Other - SOIC127P600X175-8N
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SSM2141SZ Details

  • Manufacturer Part Number:

    SSM2141SZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SO-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    R-8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Amplifier Type:

    INSTRUMENTATION AMPLIFIER

  • Bandwidth (3dB)-Nom:

    3 MHz

  • Common-mode Reject Ratio-Min:

    75 dB

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -18 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    9.5 V/us

  • Supply Current-Max:

    3.5 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    18 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Voltage Gain-Nom:

    1

  • Width:

    3.9 mm

SSM2141SZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the SSM2141SZ involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a low-ESR capacitor for the power supply decoupling.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the input and output capacitors are properly selected and placed close to the device. If oscillations occur, try adding a small resistor (e.g., 10Ω) in series with the output to dampen the oscillation.
  • The maximum power dissipation of the SSM2141SZ is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this value can be derated for higher ambient temperatures.
  • The SSM2141SZ is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the power dissipation and ensure proper heat sinking to maintain a safe operating temperature.
  • To troubleshoot issues with the SSM2141SZ, start by verifying the power supply voltage and ensuring that it's within the recommended range. Check the input and output signals using an oscilloscope to identify any anomalies. Also, ensure that the device is properly soldered and that there are no signs of overheating or physical damage.

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SSM2141SZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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