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SSM2167-1RMZ-R7 - Analog Devices

Description: Microphone Preamplifiers MICROPHONE PREAMP W/18dB FIXED GAIN Class AB 10-MSOP

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SSM2167-1RMZ-R7 - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - RM-10
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SSM2167-1RMZ-R7 Details

  • Manufacturer Part Number:

    SSM2167-1RMZ-R7

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    RM-10

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO PREAMPLIFIER

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    5 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

SSM2167-1RMZ-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the SSM2167-1RMZ-R7 involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing the device close to the power supply decoupling capacitors. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable voltage source, and decouple it with a 10uF capacitor to ground. The VEE pin should be connected to a negative voltage source or ground, depending on the application. The ISET pin should be connected to a resistor to set the output current.
  • The maximum power dissipation of the SSM2167-1RMZ-R7 is 1.4W. However, this can be affected by the operating temperature, PCB layout, and thermal management. It's essential to ensure proper heat sinking and thermal design to prevent overheating.
  • The SSM2167-1RMZ-R7 is rated for operation from -40°C to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to consider the thermal management and heat sinking requirements for high-temperature applications.
  • Common issues with the SSM2167-1RMZ-R7 include oscillations, distortion, and overheating. To troubleshoot, check the PCB layout, power supply decoupling, and component values. Ensure the device is properly biased, and the input and output signals are within the recommended specifications.

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SSM2167-1RMZ-R7 Overview

Use the download button to access the SSM2167-1RMZ-R7 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SSM21, or try a keyword search, such as Audio/Video Amplifiers

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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