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SSM2315CBZ-REEL7 - Analog Devices

Description: Filterless, High Efficiency, Mono 3 W Class-D Audio Amplifier

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SSM2315CBZ-REEL7 - Analog Devices PCB footprint - BGA - BGA - CHIPS W/SOLDER BUMPS/WLCSP-1
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SSM2315CBZ-REEL7 - Analog Devices  - 3D model - BGA - CHIPS W/SOLDER BUMPS/WLCSP-1
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SSM2315CBZ-REEL7 Details

  • Manufacturer Part Number:

    SSM2315CBZ-REEL7

  • Source Url Status Check Date:

    2013-05-01 14:56:54.763

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    1.50 X 1.50 MM, ROHS COMPLIANT, WLCSP-9

  • Pin Count:

    9

  • Manufacturer Package Code:

    CB-9-2

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    6 dB

  • Harmonic Distortion:

    10%

  • JESD-30 Code:

    S-PBGA-B9

  • JESD-609 Code:

    e1

  • Length:

    1.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    9

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    3 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA9,3X3,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.655 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    1.5 mm

SSM2315CBZ-REEL7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the SSM2315CBZ-REEL7 involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper biasing, connect the VDD pin to a stable voltage source between 2.7V and 5.5V, and the VSS pin to a solid ground plane. The voltage on the VBIAS pin should be set to the desired output voltage, typically around 1.2V to 1.8V.
  • The maximum power dissipation of the SSM2315CBZ-REEL7 is 1.4W, assuming a junction temperature of 150°C. However, the actual power dissipation will depend on the specific application and operating conditions.
  • To filter out noise and ripple, add a capacitor (e.g., 10uF) in parallel with the output, and consider adding a ferrite bead or a common-mode choke in series with the output to further reduce noise.
  • The recommended input capacitance for the SSM2315CBZ-REEL7 is 1uF to 10uF, depending on the specific application and noise requirements. A larger input capacitance can help reduce noise and ripple, but may also increase the startup time.

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SSM2315CBZ-REEL7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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