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SSM2529ACBZ-R7 - Analog Devices

Description: Audio Amp Speaker 1-CH Mono 3.1W Class-D 16-Pin WLCSP T/R

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SSM2529ACBZ-R7 - Analog Devices - PCB symbol
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PCB Footprints
SSM2529ACBZ-R7 - Analog Devices PCB footprint - BGA - BGA - 16-BALL WAFER LEVEL CHIP SCALE PACKAGE [WLCSP]
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SSM2529ACBZ-R7 - Analog Devices - 3D model - BGA - 16-BALL WAFER LEVEL CHIP SCALE PACKAGE [WLCSP]
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SSM2529ACBZ-R7 Details

  • Manufacturer Part Number:

    SSM2529ACBZ-R7

  • Source Url Status Check Date:

    2013-05-01 14:56:54.818

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Pin Count:

    16

  • Manufacturer Package Code:

    CB-16-12

  • Country Of Origin:

    Singapore

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    3

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • JESD-30 Code:

    S-PBGA-B16

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA16,4X4,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

SSM2529ACBZ-R7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the SSM2529ACBZ-R7 involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable voltage source between 2.7V and 5.5V, and the VEE pin to a stable voltage source between -2.7V and -5.5V. The voltage difference between VCC and VEE should be between 2.7V and 5.5V.
  • The maximum power dissipation of the SSM2529ACBZ-R7 is 1.4W. To ensure reliable operation, the device should be operated at a junction temperature below 150°C.
  • To protect the SSM2529ACBZ-R7 from ESD, handle the device by the body, use an anti-static wrist strap or mat, and store the device in an anti-static bag or container. Avoid touching the device's pins or exposing it to static electricity.
  • The recommended operating temperature range for the SSM2529ACBZ-R7 is -40°C to 125°C. Operating the device outside this range may affect its performance and reliability.

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SSM2529ACBZ-R7 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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