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SSM3525BCBZRL - Analog Devices

Description: Audio Amplifiers 30W Class-D w/Output sensing Amp

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SSM3525BCBZRL - Analog Devices - PCB symbol
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SSM3525BCBZRL - Analog Devices PCB footprint - BGA - BGA - . 23-Ball Wafer Level Chip Scale Package [WLCSP]
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SSM3525BCBZRL - Analog Devices - 3D model - BGA - . 23-Ball Wafer Level Chip Scale Package [WLCSP]
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SSM3525BCBZRL Details

  • Manufacturer Part Number:

    SSM3525BCBZRL

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WLCSP-23

  • Pin Count:

    23

  • Manufacturer Package Code:

    CB-23-2

  • Country Of Origin:

    Singapore

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • JESD-30 Code:

    R-PBGA-B23

  • Length:

    2.34 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    23

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    37.2 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.56 mm

  • Supply Voltage-Max (Vsup):

    17 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.22 mm

SSM3525BCBZRL Frequently Asked Questions (FAQs)

  • A good PCB layout for the SSM3525BCBZRL involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors are of high quality and have low ESR. Additionally, the device should be operated within its recommended operating conditions, and the power supply should be well-regulated.
  • The maximum power dissipation of the SSM3525BCBZRL is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this value can be derated for higher ambient temperatures.
  • The SSM3525BCBZRL is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It is recommended to derate the power dissipation and ensure proper heat sinking to maintain a safe junction temperature.
  • To troubleshoot issues with the SSM3525BCBZRL, start by verifying the power supply and input signals. Check for proper decoupling, and ensure that the device is operated within its recommended operating conditions. Use an oscilloscope to check the output waveform and verify that it meets the expected specifications. If issues persist, consult the datasheet and application notes for guidance.

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SSM3525BCBZRL Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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