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SSM3J135TU,LF - Toshiba

Description: MOSFET Small Signal MOSFET P-ch VDSS=-20V, VGSS=+/-8V, ID=-3.0A, RDS(ON)=0.103Ohm @ 4.5V, in UFM package

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SSM3J135TU,LF - Toshiba PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SSM3J135TU,LF
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SSM3J135TU,LF - Toshiba  - 3D model - SO Transistor Flat Lead - SSM3J135TU,LF
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SSM3J135TU,LF Details

  • Manufacturer Part Number:

    SSM3J135TU,LF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6.9

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    3 A

  • Drain-source On Resistance-Max:

    0.103 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    32 pF

  • JESD-30 Code:

    R-PDSO-F3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.5 W

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SSM3J135TU,LF Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SSM3J135TU,LF is a rectangular pad with a size of 1.5mm x 2.5mm, with a solder mask opening of 1.2mm x 2.2mm.
  • The SSM3J135TU,LF has a thermal resistance of 25°C/W. To handle thermal management, ensure good airflow, use a heat sink if necessary, and avoid overheating the device.
  • The maximum operating temperature range for the SSM3J135TU,LF is -40°C to 125°C.
  • Yes, the SSM3J135TU,LF is suitable for high-reliability applications, such as automotive and industrial systems, due to its high-quality manufacturing process and rigorous testing.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the pads. Avoid overheating the device.

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SSM3J135TU,LF Overview

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