Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
Toshiba recommends derating the maximum junction temperature (Tj) by 1°C for every 1W of power dissipation above 1W. Additionally, ensure good airflow and thermal conduction to the heat sink.
Although the datasheet specifies a maximum input voltage of 3.6V, Toshiba recommends limiting the input voltage to 3.3V to ensure reliable operation and minimize the risk of latch-up.
Toshiba recommends using a human-body model (HBM) ESD protection circuit with a minimum of 2kV rating. Additionally, ensure that the PCB layout and handling procedures follow ESD-safe practices.
Toshiba recommends storing the device in a dry, dark place with a temperature range of 5°C to 30°C and humidity below 60%. Avoid exposing the device to direct sunlight or moisture.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
SSM3J143TU,LF Overview
Use the download button to access the SSM3J143TU,LF schematic symbol and PCB footprint.
To find more CAD model downloads similar to this part, try a partial part number search, like SSM3J,
or try a keyword search, such as Small Signal Field-Effect Transistors
