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SSM3J15CT(TPL3) - Toshiba

Description: MOSFET P-Ch Sm Sig FET Id -1.0A -30V -20VGS

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SSM3J15CT(TPL3) - Toshiba - PCB symbol
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PCB Footprints
SSM3J15CT(TPL3) - Toshiba PCB footprint - Other - Other - SSM3K16CT,L3F-2
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3D Models
SSM3J15CT(TPL3) - Toshiba - 3D model - Other - SSM3K16CT,L3F-2
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SSM3J15CT(TPL3) Details

  • Manufacturer Part Number:

    SSM3J15CT(TPL3)

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ,

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    0

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    0.1 A

  • Drain-source On Resistance-Max:

    12 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    3.5 pF

  • JESD-30 Code:

    R-PBCC-N3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.1 W

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SSM3J15CT(TPL3) Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the SSM3J15CT is -40°C to 125°C.
  • To handle the ESD sensitivity of the SSM3J15CT, it is recommended to use an ESD protection device, such as a TVS diode, and follow proper handling and storage procedures to prevent damage from electrostatic discharge.
  • The maximum power dissipation of the SSM3J15CT is 1.5W, and it is recommended to use a heat sink to ensure reliable operation.
  • Yes, the SSM3J15CT is suitable for high-frequency applications up to 1 GHz, but it is recommended to evaluate the device's performance in the specific application and consider the effects of parasitic capacitance and inductance.
  • To ensure the reliability of the SSM3J15CT in a high-reliability application, it is recommended to follow proper design and manufacturing guidelines, including using a robust PCB design, selecting high-quality components, and performing thorough testing and validation.

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SSM3J15CT(TPL3) Overview

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