Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
Toshiba recommends using a soldering iron with a temperature of 350°C or less, and a soldering time of 3 seconds or less. The device should be soldered using a fluxless soldering process.
The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, it is recommended to keep the input voltage within the recommended operating range of 3.3V ± 10% to ensure reliable operation.
Toshiba recommends using ESD protection devices such as TVS diodes or ESD protection ICs on the input lines to protect the device from electrostatic discharge. Additionally, handling the device with an anti-static wrist strap or mat is recommended.
The recommended operating temperature range for the SSM3J16FS(TE85L,F) is -40°C to 85°C. However, the device can operate up to 125°C for a short period of time, but this may affect its reliability and lifespan.
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SSM3J16FS(TE85L,F) Overview
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