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SSM3J372R,LF - Toshiba

Description: MOSFET P-CHANNEL VDSS:-30V VGSS:-12/+

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SSM3J372R,LF - Toshiba PCB footprint - Other - Other - SSM3J372R,LF-2
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3D Models
SSM3J372R,LF - Toshiba  - 3D model - Other - SSM3J372R,LF-2
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SSM3J372R,LF Details

  • Manufacturer Part Number:

    SSM3J372R,LF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23F, 3 PIN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    5.4

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    6 A

  • Drain-source On Resistance-Max:

    0.042 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    65 pF

  • JESD-30 Code:

    R-PDSO-F3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1 W

  • Pulsed Drain Current-Max (IDM):

    24 A

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SSM3J372R,LF Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SSM3J372R,LF is a rectangular pad with a size of 1.5mm x 0.8mm, with a 0.5mm diameter via hole in the center.
  • To handle thermal considerations, ensure good thermal conductivity by using a thermal pad or a heat sink, and keep the ambient temperature within the recommended operating range of -40°C to 125°C.
  • The maximum power dissipation for the SSM3J372R,LF is 1.5W, and it is recommended to derate the power dissipation based on the ambient temperature.
  • Yes, the SSM3J372R,LF is suitable for high-frequency applications up to 100MHz, but ensure that the layout and PCB design are optimized for high-frequency operation.
  • To ensure reliability, follow proper storage and handling procedures, and ensure that the device is operated within the recommended operating conditions. Additionally, consider using a conformal coating to protect the device from moisture and contaminants.

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