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SSM3K15ACTC,L3F - Toshiba

Description: N-Channel 30 V 100mA (Ta) 500mW (Ta) Surface Mount CST3C

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SSM3K15ACTC,L3F - Toshiba - PCB symbol
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PCB Footprints
SSM3K15ACTC,L3F - Toshiba PCB footprint - Other - Other - SSM3K15ACTC,L3F-3
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SSM3K15ACTC,L3F - Toshiba - 3D model - Other - SSM3K15ACTC,L3F-3
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SSM3K15ACTC,L3F Details

  • Manufacturer Part Number:

    SSM3K15ACTC,L3F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    7

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE AND RESISTOR

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    0.1 A

  • Drain-source On Resistance-Max:

    6 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    6.5 pF

  • JESD-30 Code:

    R-XBCC-N3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.5 W

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SSM3K15ACTC,L3F Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a large copper area on the top and bottom layers connected to the thermal pad of the device, and to use thermal vias to dissipate heat efficiently.
  • To ensure proper soldering, use a soldering iron with a temperature of 350°C to 370°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the time the iron is in contact with the device.
  • Handle the device by the body, not the leads, to prevent damage. Avoid touching the leads or any other exposed metal parts to prevent electrostatic discharge (ESD) damage.
  • The input capacitance value depends on the specific application and the desired output voltage ripple. A general rule of thumb is to use a capacitance value between 10uF to 22uF, but consult the datasheet and application notes for specific guidance.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, decreased performance, and potentially even device failure. Ensure that the device is properly cooled and operated within the recommended temperature range.

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SSM3K15ACTC,L3F Overview

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