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SSM3K35CT,L3F - Toshiba

Description: MOSFET MOSFET

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PCB Footprints
SSM3K35CT,L3F - Toshiba PCB footprint - Other - Other - 2-1J1B
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3D Models
SSM3K35CT,L3F - Toshiba  - 3D model - Other - 2-1J1B
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SSM3K35CT,L3F Details

  • Manufacturer Part Number:

    SSM3K35CT,L3F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

SSM3K35CT,L3F Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
  • Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1W/m-K, and follow the recommended derating curves for temperature and current.
  • The maximum allowed voltage transient is 40V for a duration of less than 100ms, as specified in the datasheet. Exceeding this may cause damage to the device.
  • Yes, the SSM3K35CT,L3F is qualified to AEC-Q101 standards and is suitable for high-reliability and automotive applications. However, additional testing and validation may be required.
  • Follow proper ESD handling procedures, such as using an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protective package. The device has an internal ESD protection diode, but external protection is still recommended.

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SSM3K35CT,L3F Overview

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