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SSM3K37CT,L3F - Toshiba

Description: MOSFET Small-Signal MOSFET

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PCB Footprints
SSM3K37CT,L3F - Toshiba PCB footprint - Other - Other - SSM3K37CT,L3F-2
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3D Models
SSM3K37CT,L3F - Toshiba  - 3D model - Other - SSM3K37CT,L3F-2
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SSM3K37CT,L3F Details

  • Manufacturer Part Number:

    SSM3K37CT,L3F

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

SSM3K37CT,L3F Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the SSM3K37CT,L3F is -40°C to 125°C.
  • To ensure reliability in high-temperature applications, it is recommended to follow the derating guidelines provided in the datasheet, and to consider using a heat sink or thermal management system to keep the junction temperature below 125°C.
  • The maximum allowable power dissipation for the SSM3K37CT,L3F is 2.5W, and it is recommended to follow the power derating curve provided in the datasheet to ensure reliable operation.
  • To prevent damage during storage and shipping, it is recommended to store the SSM3K37CT,L3F in its original packaging, away from direct sunlight and moisture, and to handle the device by the body rather than the leads to prevent mechanical stress.
  • The recommended soldering conditions for the SSM3K37CT,L3F are a peak temperature of 260°C, a soldering time of 10 seconds or less, and a soldering iron temperature of 350°C or less.

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