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SSM6322ACPZ-R2 - Analog Devices

Description: Audio Amplifiers Next gen mobilephone HiFi headphone amp

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PCB Footprints
SSM6322ACPZ-R2 - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - CP-24-15
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3D Models
SSM6322ACPZ-R2 - Analog Devices  - 3D model - Quad Flat No-Lead - CP-24-15
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SSM6322ACPZ-R2 Details

  • Manufacturer Part Number:

    SSM6322ACPZ-R2

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFCSP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    CP-24-15

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    AUDIO AMPLIFIER

  • JESD-30 Code:

    S-XQCC-N24

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    6 V

  • Supply Voltage-Min (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

SSM6322ACPZ-R2 Frequently Asked Questions (FAQs)

  • A good PCB layout for the SSM6322ACPZ-R2 involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended operating conditions, use a stable input voltage, and add a compensation capacitor (Ccomp) between the COMP pin and the GND pin. The value of Ccomp depends on the specific application and can be calculated using the formula provided in the datasheet.
  • The maximum power dissipation of the SSM6322ACPZ-R2 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, it's recommended to derate the power dissipation based on the actual operating conditions.
  • The SSM6322ACPZ-R2 is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It's recommended to consult the datasheet and application notes for guidance on using the device in high-temperature environments.
  • To troubleshoot issues with the SSM6322ACPZ-R2, start by verifying the input voltage, output voltage, and current. Check for any signs of overheating, and ensure that the device is properly soldered and connected. Use an oscilloscope to check for any oscillations or noise on the output. Consult the datasheet and application notes for specific troubleshooting guidelines.

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SSM6322ACPZ-R2 Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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