SSM6K517NU,LF - Toshiba

SSM6K517NU,LF Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
• How do I ensure reliable operation at high temperatures?
  Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Also, consider derating the device's power dissipation at high temperatures.
• What is the maximum allowed voltage on the input pins?
  The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, for reliable operation, it is recommended to keep the input voltage within the recommended operating range of 4.5V to 5.5V.
• Can I use this device in a high-reliability or automotive application?
  Yes, the SSM6K517NU,LF is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q100 and is manufactured using a robust process with built-in reliability features.
• How do I handle ESD protection during handling and assembly?
  Toshiba recommends following standard ESD handling procedures, such as using an ESD wrist strap, mat, or workstation. The device has built-in ESD protection, but it is not a substitute for proper handling and assembly procedures.