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SSM6L820R,LXHF - Toshiba

Description: MOSFET AUTO AEC-Q SS MOS N-ch + P-ch Low Voltage Gate Drive VDSS:30V IC:4A PD:1.5W TSOP6F

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SSM6L820R,LXHF - Toshiba PCB footprint - Other - Other - SSM6L820R,LXHF-1
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SSM6L820R,LXHF - Toshiba  - 3D model - Other - SSM6L820R,LXHF-1
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SSM6L820R,LXHF Details

  • Manufacturer Part Number:

    SSM6L820R,LXHF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSOP6F, 6 PIN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    36 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    5

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    4 A

  • Drain-source On Resistance-Max:

    0.0391 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    20 pF

  • JESD-30 Code:

    R-PDSO-F6

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.4 W

  • Pulsed Drain Current-Max (IDM):

    10 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SSM6L820R,LXHF Frequently Asked Questions (FAQs)

  • Toshiba provides a recommended PCB layout in the application note AN2017061-01, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The selection of input and output capacitors depends on the specific application requirements, such as voltage rating, capacitance value, and ESR. Toshiba recommends using low-ESR capacitors with a voltage rating of at least 1.5 times the maximum input voltage. The datasheet provides a recommended capacitor value range, but it's essential to consult the capacitor manufacturer's datasheet for specific recommendations.
  • The SSM6L820R,LXHF has an operating temperature range of -40°C to 125°C, but the maximum junction temperature (TJ) is 150°C. It's essential to ensure that the device is operated within the specified temperature range to prevent thermal shutdown and ensure reliable operation.
  • To ensure EMC, follow the recommended PCB layout and component placement guidelines, use a shielded enclosure, and implement proper filtering and shielding techniques. Additionally, consult the IEC 62368-1 standard for guidance on EMC requirements and testing.
  • Toshiba recommends a soldering temperature of 260°C (peak temperature) and a soldering time of 10 seconds or less. The recommended soldering profile is a reflow profile with a peak temperature of 260°C and a dwell time of 30-60 seconds above 220°C.

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SSM6L820R,LXHF Overview

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