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SST39VF1601-70-4C-B3KE - Microchip

Description: SST39VF1601-70-4C-B3KE, Parallel Flash Memory 16Mbit, 1M x 16 bit, 70ns, 2.7V, 48-Pin, TFBGA

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SST39VF1601-70-4C-B3KE - Microchip PCB footprint - BGA - BGA - 48-Lead  TFBGA
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SST39VF1601-70-4C-B3KE - Microchip  - 3D model - BGA - 48-Lead  TFBGA
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SST39VF1601-70-4C-B3KE Details

  • Manufacturer Part Number:

    SST39VF1601-70-4C-B3KE

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    BGA

  • Package Description:

    6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, MO-210AB-1, TFBGA-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    TFBGA-48

  • Country Of Origin:

    Philippines, Taiwan

  • ECCN Code:

    3A991.B.1.A

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    3

  • Access Time-Max:

    70 ns

  • Additional Feature:

    BOTTOM BOOT BLOCK

  • Boot Block:

    BOTTOM

  • Command User Interface:

    YES

  • Common Flash Interface:

    YES

  • Data Polling:

    YES

  • Data Retention Time-Min:

    100

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PBGA-B48

  • JESD-609 Code:

    e1

  • Length:

    8 mm

  • Memory Density:

    16777216 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Sectors/Size:

    512

  • Number of Terminals:

    48

  • Number of Words:

    1048576 words

  • Number of Words Code:

    1000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    1MX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA48,6X8,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Programming Voltage:

    3 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Sector Size:

    2K

  • Standby Current-Max:

    0.00002 A

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Toggle Bit:

    YES

  • Type:

    NOR TYPE

  • Width:

    6 mm

SST39VF1601-70-4C-B3KE Frequently Asked Questions (FAQs)

  • The SST39VF1601-70-4C-B3KE has an operating temperature range of -40°C to +85°C.
  • The HOLD# signal should be asserted low to pause the current operation, and de-asserted high to resume the operation. During hold, the device will tri-state its outputs and ignore any further input signals.
  • The WP# pin is used to prevent accidental writes to the device. When WP# is low, the device is in write-protect mode, and any write operations will be ignored.
  • The SST39VF1601-70-4C-B3KE is a 16Mbit flash memory device, organized as 2,097,152 words of 8 bits each.
  • The typical programming time for the SST39VF1601-70-4C-B3KE is 10-15 microseconds per byte.

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SST39VF1601-70-4C-B3KE Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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