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SSTA56HZGT116 - ROHM Semiconductor

Description: PNP, SOT-23, -80V -0.5A, General Purpose Transistor for Automotive

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SSTA56HZGT116 - ROHM Semiconductor - PCB symbol
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PCB Footprints
SSTA56HZGT116 - ROHM Semiconductor PCB footprint - Other - Other - SOT-23(SST3)-+-
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SSTA56HZGT116 - ROHM Semiconductor - 3D model - Other - SOT-23(SST3)-+-
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SSTA56HZGT116 Details

  • Manufacturer Part Number:

    SSTA56HZGT116

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2016-06-29

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.5 A

  • Collector-Emitter Voltage-Max:

    80 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    100

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    50 MHz

SSTA56HZGT116 Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended temperature range (Ta = -40°C to 150°C). Use a heat sink or thermal interface material to maintain a safe junction temperature (Tj).
  • The maximum allowed voltage on the input pins is 6.5V. Exceeding this voltage may cause damage to the device.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input lines to protect the device from electrostatic discharge. Follow proper handling and storage procedures to prevent ESD damage.
  • Power up the device in the following sequence: VCC, then VIN. Ensure that VCC is stable before applying VIN to prevent latch-up or damage.

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SSTA56HZGT116 Overview

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