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SSURHD8560W1T4G - onsemi

Description: Ultrafast 30 ns Recovery Times; 175°C Operating Junction Temperature; High Temperature Glass Passivated Junction; High Voltage Capability to 600 V; These are Pb-Free Devices Mechanical Characteristics:; Case: Epoxy, Molded; Epoxy Meets UL 94 V-0 @ 0.125 in; Weight: 0.4 g (Approximately); Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Lead Temperature for Soldering Purposes: 260°C Max. for 10 Seconds; ESD Ratings: Machine Model = C (>400V), Human Body Model = 3B

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SSURHD8560W1T4G - onsemi PCB footprint - Other - Other - SSURHD8560W1T4G-1
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SSURHD8560W1T4G Details

  • Manufacturer Part Number:

    SSURHD8560W1T4G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DPAK-3

  • Manufacturer Package Code:

    369C

  • Country Of Origin:

    Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2016-11-30

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    ULTRA FAST RECOVERY POWER

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2.7 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.03 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

SSURHD8560W1T4G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to ensure efficient heat dissipation.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal resistance. Additionally, consider using thermal management techniques such as heat sinks or thermal interfaces.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. Ensure that the device is operated within the recommended temperature range to prevent premature failure.
  • Implement ESD protection measures such as TVS diodes, ESD arrays, or ESD-protected connectors to prevent damage from electrostatic discharge. Follow onsemi's ESD handling guidelines for proper device handling and storage.
  • Follow the recommended soldering conditions outlined in the onsemi application note, including a peak temperature of 260°C, a soldering time of 10-30 seconds, and a soldering iron temperature of 350-370°C.

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SSURHD8560W1T4G Overview

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