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ST33-75T1KI - Vishay

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ST33-75T1KI Details

  • Manufacturer Part Number:

    ST33-75T1KI

  • Pbfree Code:

    No

  • Rohs Code:

    No

  • Part Life Cycle Code:

    Active

  • Package Description:

    AXIAL LEADED

  • Reach Compliance Code:

    Unknown

  • Country Of Origin:

    Israel, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.21.00.20

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5

  • Additional Feature:

    RIPPLE CURRENT IS MEASURED AT 85 DEG CEL

  • Capacitance:

    33 µF

  • Capacitor Type:

    TANTALUM CAPACITOR

  • Diameter:

    4.78 mm

  • Dielectric Material:

    TANTALUM (WET)

  • ESR:

    2500 mΩ

  • JESD-609 Code:

    e0

  • Leakage Current:

    0.001 mA

  • Length:

    11.51 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Negative Tolerance:

    10%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    CYLINDRICAL PACKAGE

  • Package Style:

    Axial

  • Packing Method:

    TRAY

  • Polarity:

    POLARIZED

  • Positive Tolerance:

    10%

  • Rated (DC) Voltage (URdc):

    75 V

  • Ripple Current:

    409.5 mA

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Shape:

    WIRE

ST33-75T1KI Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a large copper area on the top and bottom layers, connected by multiple thermal vias, to dissipate heat efficiently. Additionally, keeping the component away from other heat sources and using a thermal pad or heat sink can further improve thermal performance.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. Apply a small amount of solder paste to the pads, and use a reflow oven or a hot air gun to solder the component. Avoid overheating or applying excessive force, which can damage the component.
  • To prevent ESD damage, handle the ST33-75T1KI in an ESD-protected environment, wear an ESD wrist strap or use an ESD mat, and avoid touching the component's pins or body. Use ESD-safe packaging and storage materials, and ensure that all equipment and tools are ESD-compliant.
  • While the ST33-75T1KI is a robust component, it's essential to ensure that the PCB is properly secured and the component is adequately supported to withstand vibrations. Consider using a vibration-resistant mounting method, such as a screw or adhesive, and ensure that the PCB is designed to minimize flexure and stress.
  • To troubleshoot issues with the ST33-75T1KI, start by checking the component's datasheet and application notes for guidance. Verify that the component is properly soldered and mounted, and that the PCB layout and thermal design are correct. Use thermal imaging or temperature measurement tools to identify hotspots, and check for signs of physical damage or wear. Consult with Vishay Intertechnologies' technical support or a qualified engineer for further assistance.

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ST33-75T1KI Overview

Use the download button to access the ST33-75T1KI 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like ST33-, or try a keyword search, such as Ceramic Capacitors

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For a full list of alternate parts for ST33-75T1KI, check out Findchips.com