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ST33KTPM2X32CKE3 - STMicroelectronics

Description: STSAFE-TPM trusted platform module 2.0 with SPI or I²C interface

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ST33KTPM2X32CKE3 - STMicroelectronics - PCB symbol
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ST33KTPM2X32CKE3 - STMicroelectronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UFQFPN 32 5x5x0.55 mm_2023
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ST33KTPM2X32CKE3 - STMicroelectronics - 3D model - Quad Flat No-Lead - UFQFPN 32 5x5x0.55 mm_2023
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ST33KTPM2X32CKE3 Details

  • Manufacturer Part Number:

    ST33KTPM2X32CKE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    UFQFPN-32

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    STMicroelectronics

  • Additional Feature:

    3.3V SUPPLY ALSO AVAILABLE

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.6 mm

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    CRYPTOGRAPHIC AUTHENTICATOR

ST33KTPM2X32CKE3 Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout guide in their application note AN5156, which includes guidelines for component placement, routing, and shielding to ensure optimal performance and security.
  • STMicroelectronics provides a secure boot and firmware update guide in their application note AN5197, which outlines the steps to implement secure boot and firmware updates using the ST33KTPM2X32CKE3's built-in cryptographic capabilities.
  • The ST33KTPM2X32CKE3 has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to follow proper thermal management practices, such as using a heat sink, thermal interface material, and ensuring good airflow around the device.
  • STMicroelectronics provides a range of debugging tools and software, including the STM32CubeTPM tool, which allows developers to debug and troubleshoot issues with the ST33KTPM2X32CKE3. Additionally, the device's built-in debug interfaces, such as JTAG and SWD, can be used to debug and troubleshoot issues.
  • The ST33KTPM2X32CKE3 is a Trusted Platform Module (TPM) that complies with the Trusted Computing Group (TCG) TPM 2.0 specification. It's essential to ensure that your product meets the relevant compliance and certification requirements, such as Common Criteria, FIPS, and others, depending on your target market and application.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

ST33KTPM2X32CKE3 Overview

Use the download button to access the ST33KTPM2X32CKE3 schematic symbol, PCB footprint, and 3D model.
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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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