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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for ST470-50T3KI
- Part Number ST470-50T3KI
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
ST470-50T3KI Details
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Manufacturer Part Number:
ST470-50T3KI
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Pbfree Code:
No
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Rohs Code:
No
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Part Life Cycle Code:
Active
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Package Description:
,
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Reach Compliance Code:
Unknown
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Country Of Origin:
Israel, USA
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ECCN Code:
EAR99
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HTS Code:
8532.21.00.20
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
4
ST470-50T3KI Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the ST470-50T3KI is a rectangular pad with dimensions of 5.5 mm x 3.5 mm, with a thermal pad of 2.5 mm x 2.5 mm in the center. The pad should have a solder mask defined (SMD) and a non-solder mask defined (NSMD) area around the thermal pad.
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To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. Apply a small amount of solder paste to the PCB pads, and use a reflow oven or a hot air gun to solder the component. Avoid using excessive solder or flux, as it can cause bridging or shorts.
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The maximum allowed voltage derating for the ST470-50T3KI is 80% of the maximum rated voltage (50 V) at high temperatures (above 150°C). This means that the maximum allowed voltage at high temperatures is 40 V.
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During assembly, the thermal pad of the ST470-50T3KI should be connected to a copper plane on the PCB to ensure good thermal conductivity. Apply a thin layer of thermal interface material (TIM) to the thermal pad before attaching a heat sink or thermal interface plate.
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The recommended storage condition for the ST470-50T3KI is in a dry, cool place with a temperature range of 5°C to 30°C and relative humidity below 60%. Avoid storing the components in direct sunlight or near sources of moisture.
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ST470-50T3KI Overview
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