The recommended PCB footprint for the ST470-50T3MI is a rectangular pad with dimensions of 5.5 mm x 3.5 mm, with a thermal pad in the center. The pad should have a solder mask defined (SMD) and a non-solder mask defined (NSMD) area around the thermal pad.
To ensure proper thermal management, it is recommended to use a thermal interface material (TIM) between the device and the heat sink, and to design the heat sink to have a thermal resistance of less than 10°C/W. Additionally, ensure good airflow around the device and heat sink.
The maximum allowed voltage derating for the ST470-50T3MI is 80% of the maximum rated voltage, which is 50 V. Therefore, the maximum allowed voltage derating is 40 V.
Yes, the ST470-50T3MI is suitable for high-frequency switching applications up to 100 kHz. However, it is essential to consider the device's switching losses, thermal management, and PCB layout to ensure reliable operation.
During startup and shutdown, the ST470-50T3MI's power dissipation can be high due to inrush currents. To handle this, use a soft-start circuit or a current limiter to limit the inrush current, and ensure the device is properly bypassed with capacitors to reduce voltage transients.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
ST470-50T3MI Overview
Use the download button to access the ST470-50T3MI schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ST470,
or try a keyword search, such as Tantalum Capacitors
