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ST485EBN - STMicroelectronics

Description: 4.75V ~ 5.25V, +/-15 kV ESD protected, low power RS-485/RS-422 transceiver

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ST485EBN - STMicroelectronics - PCB symbol
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ST485EBN - STMicroelectronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - DIP-8_2026
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ST485EBN - STMicroelectronics - 3D model - Dual-In-Line Packages - DIP-8_2026
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ST485EBN Details

  • Manufacturer Part Number:

    ST485EBN

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    LEAD FREE, PLASTIC, DIP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.8 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Low Current-Max:

    0.004 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    130 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    4.8 mm

  • Supply Current-Max:

    0.9 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    45 ns

  • Width:

    7.62 mm

ST485EBN Frequently Asked Questions (FAQs)

  • The maximum cable length supported by ST485EBN is dependent on the baud rate and the type of cable used. As a general rule, the maximum cable length is around 1200 meters at a baud rate of 9600bps, but it can be shorter at higher baud rates. It's recommended to consult the RS-485 standard and perform signal integrity analysis to determine the maximum cable length for a specific application.
  • To ensure reliable communication over long distances with ST485EBN, it's essential to follow proper PCB layout and design guidelines, use twisted-pair cables with a characteristic impedance of 120 ohms, and implement termination resistors at both ends of the bus. Additionally, consider using repeaters or signal conditioners to boost the signal and improve signal integrity.
  • Yes, ST485EBN can be used in a multi-point configuration, but it's essential to ensure that only one device is transmitting at a time to avoid data collisions. A master-slave architecture or a token-passing protocol can be used to manage data transmission and prevent collisions.
  • The maximum number of nodes that can be connected to a single ST485EBN bus is 32, as per the RS-485 standard. However, the actual number of nodes that can be connected may be limited by the bus loading, cable length, and signal integrity.
  • To protect ST485EBN from EMI, it's essential to use proper shielding, grounding, and filtering techniques. Use twisted-pair cables with a shield, and connect the shield to the ground at one end of the cable. Additionally, consider using EMI filters or common-mode chokes to reduce electromagnetic radiation.

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ST485EBN Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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