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ST62T09CB6 - STMicroelectronics

Description: 8-bit MCUs with A/D converter, two timers, oscillator safeguard & safe reset

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ST62T09CB6 - STMicroelectronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 20-Pin Plastic Dual In-Line Package, 300-mil Width
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3D Models
ST62T09CB6 - STMicroelectronics  - 3D model - Dual-In-Line Packages - 20-Pin Plastic Dual In-Line Package, 300-mil Width
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ST62T09CB6 Details

  • Manufacturer Part Number:

    ST62T09CB6

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Pin Count:

    20

  • HTS Code:

    8542.31.00.15

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES AT 3V MINIMUM SUPPLY

  • Bit Size:

    8

  • Boundary Scan:

    NO

  • CPU Family:

    ST6200

  • Clock Frequency-Max:

    8 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    R-PDIP-T20

  • JESD-609 Code:

    e3

  • Length:

    26.16 mm

  • Number of I/O Lines:

    12

  • Number of Terminals:

    20

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP20,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    64

  • ROM (words):

    1024

  • ROM Programmability:

    OTPROM

  • Seated Height-Max:

    5.33 mm

  • Speed:

    8 MHz

  • Supply Current-Max:

    3.5 mA

  • Supply Voltage-Max:

    6 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    HCMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

ST62T09CB6 Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN1013, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The ST62T09CB6 has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat efficiently. Additionally, the device should be mounted on a heat sink or a metal core PCB to further improve thermal management.
  • STMicroelectronics recommends using X7R or X5R ceramic capacitors with a value of 10uF to 22uF for the input and output capacitors. The capacitors should be placed as close as possible to the device pins to minimize parasitic inductance and ensure stable operation.
  • To ensure EMC compliance, the device should be used with a shielded enclosure, and the PCB should be designed with EMC in mind, including the use of ground planes, shielding, and filtering. Additionally, the device should be tested for EMC compliance according to relevant standards such as IEC 61000-4-2 and IEC 61000-4-4.
  • STMicroelectronics recommends a soldering profile with a peak temperature of 260°C and a dwell time of 30-60 seconds. The device should be soldered using a reflow soldering process, and the soldering profile should be optimized to minimize thermal stress and ensure reliable operation.

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ST62T09CB6 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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