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STA309A13TR - STMicroelectronics

Description: STMICROELECTRONICS - STA309A13TR - Audio Control, Audio Digital Signal Processor, 3V to 3.6V, I2C, TQFP, 64 Pins, -40 °C

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STA309A13TR - STMicroelectronics PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP, 10 X 10 X 1.4 PKG, 0.5 PITCH, 64LD
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3D Models
STA309A13TR - STMicroelectronics  - 3D model - Quad Flat Packages - LQFP, 10 X 10 X 1.4 PKG, 0.5 PITCH, 64LD
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STA309A13TR Details

  • Manufacturer Part Number:

    STA309A13TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    10 X 10 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, TQFP-64

  • Pin Count:

    64

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    90 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    10 mm

STA309A13TR Frequently Asked Questions (FAQs)

  • A good PCB layout for the STA309A13TR should include a solid ground plane, wide power traces, and a thermal relief pattern under the device to facilitate heat dissipation. A 4-layer PCB with a dedicated thermal layer is recommended.
  • To ensure reliable operation in high-temperature environments, ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended thermal design guidelines. Additionally, consider using a thermistor or thermocouple to monitor the device temperature.
  • For the STA309A13TR, use X7R or X5R ceramic capacitors with a voltage rating of 10V or higher for input and output capacitors. A 10uF capacitor is recommended for the input, and a 22uF capacitor is recommended for the output.
  • Use a voltage supervisor or a power-on reset (POR) circuit to monitor the input voltage and ensure the device is powered on only within the recommended operating range. Additionally, consider using a transient voltage suppressor (TVS) diode to protect against voltage spikes.
  • To minimize electromagnetic interference (EMI), use a pi-filter (L-C-L) or a common-mode choke on the input and output lines. Additionally, consider using a shielded inductor and a ferrite bead on the output line to reduce radiated emissions.

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STA309A13TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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